DocumentCode
1244450
Title
Test planning for modular testing of hierarchical SOCs
Author
Chakrabarty, Krishnendu ; Iyengar, Vikram ; Krasniewski, Mark D.
Author_Institution
Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
Volume
24
Issue
3
fYear
2005
fDate
3/1/2005 12:00:00 AM
Firstpage
435
Lastpage
448
Abstract
Multilevel test access mechanism (TAM) optimization is necessary for modular testing of hierarchical systems-on-chip (SOCs) that contain older-generation SOCs as embedded megacores. We consider the case where these older-generation SOCs are used as hard cores in new SOC designs, and they are delivered to the system integrator as optimized and technology-mapped layouts. We present three hierarchical test planning and TAM optimization flows that exploit recent advances in TAM design for flattened SOC hierarchies. These techniques are based on the reuse of existing TAM architectures within megacores and the optimization of the top-level TAM under the constraints imposed by "TAM-ed" megacores that are delivered either with or without a wrapper. We present a new megacore wrapper-design technique for the latter case. Unlike prior methods that assume flat test hierarchies, the proposed methods are directly applicable to real-world design-transfer models involving hard megacores between the core vendor and the system integrator for hierarchical SOCs. Experimental results are presented for four ITC\´02 SOC test benchmarks that contain megacores.
Keywords
circuit optimisation; integrated circuit design; integrated circuit testing; system-on-chip; SOC designs; TAM architectures; TAM optimization flows; TAM-ed megacores; design transfer model; flat test hierarchies; hand-off model; hard cores; hierarchical systems-on-chip; megacore wrapper-design; modular testing; multilevel test access mechanism optimization; technology-mapped layouts; test planning; test wrappers; Benchmark testing; Circuit testing; Companies; Constraint optimization; Design optimization; Logic testing; Microelectronics; System testing; System-on-a-chip; Very large scale integration; Design transfer and hand-off model; TAM optimization; hard cores; megacores; test access mechanism (TAM); test wrappers; testing time;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/TCAD.2004.842816
Filename
1397803
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