Title :
Effects of built-in polarization on InGaN-GaN vertical-cavity surface-emitting lasers
Author :
Piprek, Joachim ; Farrell, Robert ; DenBaars, Steve ; Naka, Shuji
Author_Institution :
Mater. Dept., Univ. of California, Santa Barbara, CA, USA
Abstract :
We investigate the effect of built-in spontaneous and piezoelectric polarization on the internal device physics of current-injected GaN-based vertical-cavity surface-emitting lasers (VCSELs) with strained InGaN quantum wells. Advanced device simulation is applied to a previously manufactured device design featuring dielectric mirrors and an indium-tin-oxide current injection layer. Contrary to common perception, we show: 1) that only a small fraction of the built-in quantum-well polarization is screened at typical injection current densities and 2) that the polarization of the AlGaN electron stopper layer has a strong effect on the VCSEL threshold current which can be partly compensated for by higher p-doping.
Keywords :
III-V semiconductors; dielectric devices; gallium compounds; indium compounds; laser cavity resonators; laser mirrors; light polarisation; piezoelectricity; quantum well lasers; semiconductor device models; semiconductor doping; surface emitting lasers; AlGaN; ITO; InGaN-GaN; InGaN-GaN lasers; InSnO; advanced device simulation; built-in polarization; current-injected lasers; device design simulation; dielectric mirrors; electron stopper layer; indium-tin-oxide current injection layer; injection current densities; internal device physics; p-doping; piezoelectric polarization; strained InGaN quantum wells; vertical-cavity surface-emitting lasers; Current density; Dielectric devices; Laser theory; Mirrors; Physics; Piezoelectric polarization; Quantum well lasers; Surface emitting lasers; Vertical cavity surface emitting lasers; Virtual manufacturing; Electron leakage; GaN-based light emitter; InGaN quantum well; numerical simulation; piezoelectric effect; polarization; vertical-cavity surface-emitting laser (VCSEL);
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2005.860045