• DocumentCode
    1245873
  • Title

    A unified design methodology for CMOS tapered buffers

  • Author

    Cherkauer, Brian S. ; Friedman, Eby G.

  • Author_Institution
    Dept. of Electr. Eng., Rochester Univ., NY, USA
  • Volume
    3
  • Issue
    1
  • fYear
    1995
  • fDate
    3/1/1995 12:00:00 AM
  • Firstpage
    99
  • Lastpage
    111
  • Abstract
    In this paper, the various disparate approaches to CMOS tapered buffer design are unified into an integrated design methodology. Circuit speed, power dissipation, physical area, and system reliability are the four performance criteria of concern in tapered buffers, and each places a separate, often conflicting, constraint on the design of a tapered buffer. Enhanced short-channel tapered buffer design equations are presented for propagation delay and power dissipation, as well as a new split-capacitor model of hot-carrier reliability of tapered buffers and a two-component physical area model. Each performance criterion is individually investigated and analyzed with respect to the number of stages and tapering factor, and the interaction of the four criteria is examined to develop both a qualitative and a quantitative understanding of the various design tradeoffs. The creation of process dependent look-up tables for optimal buffer design is described, and a methodology to apply these look-up tables to application-specific tapered buffers for both unconstrained and constrained systems is developed.<>
  • Keywords
    CMOS logic circuits; buffer circuits; delays; hot carriers; integrated circuit design; integrated circuit reliability; logic design; logic gates; CMOS tapered buffers; circuit speed; constrained systems; design tradeoffs; hot-carrier reliability; performance criteria; physical area; power dissipation; process dependent look-up tables; propagation delay; split-capacitor model; system reliability; tapering factor; unconstrained systems; unified design methodology; Design methodology; Equations; Impedance; Integrated circuit interconnections; Performance analysis; Power dissipation; Power system modeling; Propagation delay; Reliability; Semiconductor device modeling;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/92.365457
  • Filename
    365457