DocumentCode :
1245904
Title :
MCM-L technology: a systems cost analysis for a high volume automotive electronics application
Author :
Evans, John L. ; Bosley, Lany E. ; Romanczuk, Chris S. ; Johnson, R. Wayne
Author_Institution :
Chrysler Corp., Huntsville, AL, USA
Volume :
18
Issue :
1
fYear :
1995
fDate :
2/1/1995 12:00:00 AM
Firstpage :
28
Lastpage :
32
Abstract :
Cost concerns related to the development and manufacturability of multichip modules have limited the widespread use of MCMs for high-volume low-cost applications. This paper discusses the many elements necessary to evaluate fully the financial effects of MCM programs. In particular, this paper evaluates a development program for a multichip module design targeted for a high volume automotive electronics control module. Often the added material costs associated with multichip modules prohibit MCM usage for low cost applications. This paper deals with the overall costs and savings associated with MCM development. While each decision to incorporate MCMs within a product design must be made individually, the analysis detailed below provides considerable insight into the overall systems cost involved with MCMs
Keywords :
automotive electronics; economics; integrated circuit manufacture; integrated circuit packaging; multichip modules; MCM-L technology; automotive electronics; low cost applications; manufacturability; material costs; product design; systems cost analysis; Automotive electronics; Consumer electronics; Control systems; Costs; Electromagnetic interference; Electronics packaging; Engines; Multichip modules; Product design; Semiconductor device packaging;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9894
Type :
jour
DOI :
10.1109/96.365478
Filename :
365478
Link To Document :
بازگشت