MCM-L technology: a systems cost analysis for a high volume automotive electronics application

Author

Evans, John L. ; Bosley, Lany E. ; Romanczuk, Chris S. ; Johnson, R. Wayne

Author_Institution

Chrysler Corp., Huntsville, AL, USA

Volume

18

Issue

1

fYear

1995

fDate

2/1/1995 12:00:00 AM

Firstpage

28

Lastpage

32

Abstract

Cost concerns related to the development and manufacturability of multichip modules have limited the widespread use of MCMs for high-volume low-cost applications. This paper discusses the many elements necessary to evaluate fully the financial effects of MCM programs. In particular, this paper evaluates a development program for a multichip module design targeted for a high volume automotive electronics control module. Often the added material costs associated with multichip modules prohibit MCM usage for low cost applications. This paper deals with the overall costs and savings associated with MCM development. While each decision to incorporate MCMs within a product design must be made individually, the analysis detailed below provides considerable insight into the overall systems cost involved with MCMs

Keywords

automotive electronics; economics; integrated circuit manufacture; integrated circuit packaging; multichip modules; MCM-L technology; automotive electronics; low cost applications; manufacturability; material costs; product design; systems cost analysis; Automotive electronics; Consumer electronics; Control systems; Costs; Electromagnetic interference; Electronics packaging; Engines; Multichip modules; Product design; Semiconductor device packaging;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.365478

Filename

365478