DocumentCode
1245936
Title
Algorithms for coupled transient simulation of circuits and complicated 3-D packaging
Author
Silveira, Luís Miguel ; Kamon, Mattan ; White, Jacob
Author_Institution
Res. Lab. of Electron., MIT, Cambridge, MA, USA
Volume
18
Issue
1
fYear
1995
fDate
2/1/1995 12:00:00 AM
Firstpage
92
Lastpage
98
Abstract
Techniques are described for coupled simulation of complicated 3-D interconnect and nonlinear transistor drivers and receivers. The approach is based on combining: multipole-accelerated method-of-moments techniques for extracting frequency-dependent inductances and resistances for the interconnect; a sectioning method for fitting the frequency-domain data with a rational function; a balanced-realization approach to reducing the order of the rational function in a guaranteed stable manner; and an implementation of fast recursive convolution to incorporate the rational function in SPICE3. Results are presented to demonstrate some of the frequency-dependent effects in a packaging analysis problem
Keywords
SPICE; circuit analysis computing; convolution; distributed parameter networks; driver circuits; inductance; integrated circuit interconnections; method of moments; packaging; transient analysis; 3D packaging; SPICE3; balanced-realization approach; coupled transient simulation; fast recursive convolution; frequency-dependent inductances; frequency-dependent resistances; frequency-domain data; interconnect; method-of-moments techniques; multipole-accelerated moment methods; nonlinear transistor drivers; nonlinear transistor receivers; packaging analysis problem; rational function; sectioning method; Circuit simulation; Conductors; Convolution; Coupling circuits; Electronics packaging; Frequency; Inductance; Integrated circuit interconnections; Transmission line matrix methods; Voltage;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.365494
Filename
365494
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