• DocumentCode
    1245936
  • Title

    Algorithms for coupled transient simulation of circuits and complicated 3-D packaging

  • Author

    Silveira, Luís Miguel ; Kamon, Mattan ; White, Jacob

  • Author_Institution
    Res. Lab. of Electron., MIT, Cambridge, MA, USA
  • Volume
    18
  • Issue
    1
  • fYear
    1995
  • fDate
    2/1/1995 12:00:00 AM
  • Firstpage
    92
  • Lastpage
    98
  • Abstract
    Techniques are described for coupled simulation of complicated 3-D interconnect and nonlinear transistor drivers and receivers. The approach is based on combining: multipole-accelerated method-of-moments techniques for extracting frequency-dependent inductances and resistances for the interconnect; a sectioning method for fitting the frequency-domain data with a rational function; a balanced-realization approach to reducing the order of the rational function in a guaranteed stable manner; and an implementation of fast recursive convolution to incorporate the rational function in SPICE3. Results are presented to demonstrate some of the frequency-dependent effects in a packaging analysis problem
  • Keywords
    SPICE; circuit analysis computing; convolution; distributed parameter networks; driver circuits; inductance; integrated circuit interconnections; method of moments; packaging; transient analysis; 3D packaging; SPICE3; balanced-realization approach; coupled transient simulation; fast recursive convolution; frequency-dependent inductances; frequency-dependent resistances; frequency-domain data; interconnect; method-of-moments techniques; multipole-accelerated moment methods; nonlinear transistor drivers; nonlinear transistor receivers; packaging analysis problem; rational function; sectioning method; Circuit simulation; Conductors; Convolution; Coupling circuits; Electronics packaging; Frequency; Inductance; Integrated circuit interconnections; Transmission line matrix methods; Voltage;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9894
  • Type

    jour

  • DOI
    10.1109/96.365494
  • Filename
    365494