A 3-D electromagnetic simulator for high frequency applications

Author

Zheng, Jim-X

Author_Institution

Zeland Software Inc., Fremont, CA, USA

Volume

18

Issue

1

fYear

1995

fDate

2/1/1995 12:00:00 AM

Firstpage

112

Lastpage

118

Abstract

A general purpose full-wave electromagnetic simulator IE3-D has been developed for the analysis and design of high-frequency and high-speed electronic circuit structures. For an arbitrarily shaped 3-D metallic layered structure, the integral equation, and method of moment-based simulator solves the current distribution on the structure expanded into roof-top functions on a set of 3-D triangular and rectangular cells. The circuit parameters are extracted from the solved current distribution in the form of either S-parameters frequency response and RLC-equivalent circuit in SPICE format

Keywords

S-parameters; SPICE; circuit analysis computing; current distribution; digital circuits; digital simulation; equivalent circuits; frequency response; integral equations; method of moments; microwave circuits; packaging; 3D electromagnetic simulator; 3D rectangular cells; 3D triangular cells; IE3-D; RLC-equivalent circuit; S-parameters frequency response; SPICE format; circuit parameters; current distribution; full-wave EM simulator; high frequency applications; high-speed electronic circuits; integral equation; method of moment-based simulator; roof-top functions; Algorithm design and analysis; Analytical models; Circuit simulation; Coupling circuits; Current distribution; Electromagnetic analysis; Electromagnetic radiation; Electronic circuits; Frequency; Integral equations;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.365497

Filename

365497