DocumentCode
1245973
Title
A micromachined array probe card-fabrication process
Author
Beiley, Mark ; Leung, Justin ; Wong, S. Simon
Author_Institution
IBM Corp., Essex Junction, VT, USA
Volume
18
Issue
1
fYear
1995
fDate
2/1/1995 12:00:00 AM
Firstpage
179
Lastpage
183
Abstract
A probe card designed to address future testing requirements has been demonstrated. The fabrication process is described in detail. The array probe card is a membrane style probe card fabricated from a silicon wafer with typical integrated circuit and micromachining technologies. The probe card is capable of providing a very large number of probe tips (>1000) in any format, including the array pad format, and is designed to satisfy the requirements for high speed and high resolution wafer-level testing
Keywords
integrated circuit technology; integrated circuit testing; membranes; micromachining; multichip modules; probes; silicon; test equipment; Si; Si wafer; W; array pad format; fabrication process; high resolution testing; high speed testing; membrane style probe card; micromachined array probe card; probe tips; wafer-level testing; Biomembranes; Circuit testing; Fabrication; Integrated circuit technology; Micromachining; Packaging; Polyimides; Probes; Silicon; Wafer scale integration;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.365506
Filename
365506
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