A micromachined array probe card-characterization

Author

Beiley, Mark ; Leung, Justin ; Wong, S. Simon

Author_Institution

IBM Corp., Essex Junction, VT, USA

Volume

18

Issue

1

fYear

1995

fDate

2/1/1995 12:00:00 AM

Firstpage

184

Lastpage

191

Abstract

An array probe card fabricated on a silicon wafer for high performance and high pin count applications is characterized. The probe card is capable of providing a very large number of probe tips (>1000) that offer a contact resistance of less than 2 Ω. A novel approach to replacing the mechanical scrubbing motion with an electrical breakdown process is presented. The probe card is capable of operating at elevated temperatures for extended periods of time, offers alternative probe tip configurations, and is capable of probing a variety of pad metals. Controlled impedance (50 Ω) striplines that run all the way to the probe tips offer a delay time of 68 ps/cm, 3 GHz bandwidth, and far-end cross-talk of -49 dB/cm at a pitch of 32 μm

Keywords

contact resistance; crosstalk; electric breakdown; electric impedance; integrated circuit testing; probes; silicon; strip lines; test equipment; 2 ohm; 3 GHz; 32 micron; Si; Si wafer; characterization; contact resistance; controlled impedance striplines; crosstalk; electrical breakdown process; elevated temperature operation; high pin count applications; micromachined array probe card; probe tips; Biomembranes; Circuit testing; Contact resistance; Electric breakdown; Impedance; Integrated circuit interconnections; Kelvin; Probes; Silicon; Voltage;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.365507

Filename

365507