Title :
Inductance-controlled electroabsorption Modulator modules using the flip-chip bonding technique
Author :
Hatta, Tatsuo ; Miyahara, Toshiharu ; Ishizaki, Mitsunori ; Okada, Norio ; Zaizen, Shiho ; Motoshima, Kuniaki ; Kasahara, Kumio
Author_Institution :
Inf. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo, Japan
Abstract :
The wire-bonding technique is widely used for the connections between the electroabsorption (EA) modulator chips and the electrical signal transmission lines. However, the parasitic inductance of the bonding wire degrades the electrical characteristics of the EA modulator modules in a high-frequency region. In this paper, we theoretically analyze the influence of parasitic inductance on the base-band digital transmission and obtain the relationship between the EA modulator capacitance and the optimum lead inductance. For precise inductance control, we introduced the flip-chip bonding (FCB) technique and fabricated 40-Gb/s EA modulator modules.
Keywords :
assembling; capacitance; electric variables control; electro-optical modulation; electroabsorption; flip-chip devices; inductance; modules; production control; 40 Gbit/s; EA modulator capacitance; EA modulator fabrication; assembling technology; base-band digital transmission; chip mounting technology; electroabsorption modulator modules; flip-chip bonding; inductance-controlled modulator; optimum lead inductance; parasitic inductance; precise inductance control; Bandwidth; Bonding; Capacitance; Electrodes; Gold; Impedance; Inductance; Optical modulation; Semiconductor materials; Transmission line theory; Digital modulation; electroabsorption (EA); flip-chip devices; inductance;
Journal_Title :
Lightwave Technology, Journal of
DOI :
10.1109/JLT.2004.842303
