On-chip solid-state cooling for integrated circuits using thin-film microrefrigerators

Author

Shakouri, Ali ; Zhang, Yan

Author_Institution

Baskin Sch. of Eng., Univ. of California, Santa Cruz, CA, USA

Volume

28

Issue

1

fYear

2005

fDate

3/1/2005 12:00:00 AM

Firstpage

65

Lastpage

69

Abstract

An overview of recent advances in solid-state cooling utilizing thin-film silicon germanium-based microrefrigerators is given. Key parameters affecting micro cooler performance are described. A 3-μm thick 200× (3 nm Si/12 nm Si_0.75Ge_0.25) superlattice device can achieve maximum cooling of 4°C at room temperature, maximum cooling power density of 600 W/cm² for 40-μm diameter device and fast transient response on the order of tens of micro-seconds independent of the device size. Three-dimensional electrothermal simulations show that individual microrefrigerators could be used to remove hot spots in silicon chips with minimal increase in the overall power dissipation.

Keywords

Ge-Si alloys; cooling; integrated circuits; semiconductor superlattices; thermal management (packaging); thermoelectric devices; thin film devices; transient response; 3 micron; 3D electrothermal simulation; 4 C; 40 micron; SiGe; integrated circuits; maximum cooling power density; micro cooler performance; on-chip solid-state cooling; silicon chips; silicon germanium; superlattice device; thin-film microrefrigerators; transient response; Cooling; Electrothermal effects; Power dissipation; Semiconductor thin films; Silicon; Solid state circuits; Superlattices; Temperature; Thin film circuits; Transient response; Microrefrigerators; silicon chips; thin-film silicon germanium-based microrefrigerators;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2005.843219

Filename

1402614