Fast Simulation of steady-state temperature distributions in electronic components using multidimensional model reduction

In this paper, a model reduction technique is applied to the thermal modeling of electronic components and devices with complex geometries. The reduced-order model is capable of predicting a complete detailed three-dimensional temperature distribution in the original model. The small size and the simplicity of the reduced model allows for the very quick simulation of the device under a wide range of input parameters, such as different boundary conditions and power distributions. Use of the reduced-order model in a thermal design cycle can have a significant effect on both prediction accuracy and simulation efficiency. In the paper, the usefulness of this technique is demonstrated through examples from different electronic devices and packages. Accuracy of the reduced-order model is validated by comparison with the solution to a detailed numerical model.