Title :
A monolithic surface micromachined accelerometer with digital output
Author :
Lu, Crist ; Lemkin, Mark ; Boser, Bernhard E.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fDate :
12/1/1995 12:00:00 AM
Abstract :
A surface micromachined accelerometer with on-chip electronics realized in a 3 μm BiCMOS technology is described. The sensing element consists of a thin film of polysilicon that is deposited after fabrication of the electronic circuitry. Acceleration is measured by capacitively sensing sub-angstrom displacements of a mechanical proof-mass weighing 0.5 μgrams. The sensor uses force-feedback and achieves a resolution of 1.6 mg/√(Hz) (1 g=9.8 m/s2). The limitations arising from the small size and mass of the sensing element and means for improvement are discussed. The small active die area of less than 3 mm2 including the sensor along with the possibility to combine several different sensors on a single chip make this approach particularly attractive for applications demanding very small form factors
Keywords :
BiCMOS integrated circuits; accelerometers; digital readout; electric sensing devices; elemental semiconductors; feedback; micromachining; microsensors; silicon; 0.5 mug; 3 micron; BiCMOS technology; Si; capacitive sensing; digital output; fabrication; force-feedback; monolithic surface micromachined accelerometer; onchip electronics; polysilicon thin film; sensing element; sub-angstrom displacements; Acceleration; Accelerometers; BiCMOS integrated circuits; Consumer electronics; Fabrication; Mechanical sensors; Micromachining; Semiconductor device measurement; Sputtering; Thin film circuits;
Journal_Title :
Solid-State Circuits, IEEE Journal of