DocumentCode
1246648
Title
Re-engineering silicon: Si-Ge heterojunction bipolar technology
Author
Cressler, John D.
Author_Institution
Auburn Univ., AL, USA
Volume
32
Issue
3
fYear
1995
fDate
3/1/1995 12:00:00 AM
Firstpage
49
Lastpage
55
Abstract
Thanks to refined techniques of material growth, circuits based on Si-Ge devices have made their way to market and bode especially well for wireless communications. The author reviews material properties, HBT technologies and circuit applications
Keywords
Ge-Si alloys; bipolar integrated circuits; heterojunction bipolar transistors; semiconductor growth; semiconductor materials; HBT technologies; Si-Ge heterojunction bipolar technology; SiGe; circuit applications; high speed chips; material growth; material properties; ring oscillator; wireless communications; Capacitive sensors; Chemical vapor deposition; Cutoff frequency; Germanium silicon alloys; Heterojunctions; Lattices; Photonic band gap; Semiconductor films; Silicon germanium; Transistors;
fLanguage
English
Journal_Title
Spectrum, IEEE
Publisher
ieee
ISSN
0018-9235
Type
jour
DOI
10.1109/6.367973
Filename
367973
Link To Document