• DocumentCode
    1247252
  • Title

    SOI single-electron transistor with low RC delay for logic cells and SET/FET hybrid ICs

  • Author

    Park, Kyu-Sul ; Kim, Sang-Jin ; Baek, In-Bok ; Lee, Won-Hee ; Kang, Jong-Seuk ; Jo, Yong-Bum ; Lee, Sang Don ; Lee, Chang-Keun ; Choi, Jung-Bum ; Kim, Jang-Han ; Park, Keun-Hyung ; Cho, Won-Ju ; Jang, Moon-Gyu ; Lee, Seong-Jae

  • Author_Institution
    Memory Div., Samsung Electron. Co. Ltd., Hwasung, South Korea
  • Volume
    4
  • Issue
    2
  • fYear
    2005
  • fDate
    3/1/2005 12:00:00 AM
  • Firstpage
    242
  • Lastpage
    248
  • Abstract
    We report on a successful fabrication of silicon-based single-electron transistors (SETs) with low RC time constant and their applications to complementary logic cells and SET/field-effect transistor (FET) hybrid integrated circuit. The SETs were fabricated on a silicon-on-insulator (SOI) structure by a pattern-dependent oxidation (PADOX) technique, combined with e-beam lithography. Drain conductances measured at 4.2 K approach large values of the order of microsiemens, exhibiting Coulomb oscillations with peak-to-valley current ratios ≫1000. Data analysis with a probable mechanism of PADOX yields their intrinsic speeds of ∼ 2 THz, which is within an order of magnitude of the theoretical quantum limit. Incorporating these SETs as basic elements, in-plane side gate-controlled complementary logic cells and SET/FET hybrid integrated circuits were fabricated on an SOI chip. Such an in-plane structure is very efficient in the Si fabrication process, and the side gates adjacent to the electron island could easily control the phase of Coulomb oscillations. The input-output voltage transfer, characteristic of the logic cell, shows an inverting behavior where the output voltage gain is estimated to be about 1.2 at 4.2 K. The SET/FET hybrid integrated circuit consisting of one SET and three FETs yields a high-voltage gain and power amplification with a wide-range output window for driving the next circuit. The small SET input gate voltage of 30 mV is finally converted to 400 mV, corresponding to an amplification ratio of 13.
  • Keywords
    Coulomb blockade; electron beam lithography; elemental semiconductors; field effect integrated circuits; field effect logic circuits; field effect transistors; hybrid integrated circuits; oxidation; silicon; silicon-on-insulator; single electron transistors; submillimetre wave integrated circuits; submillimetre wave transistors; very high speed integrated circuits; 1.2 dB; 2 THz; 30 mV; 4.2 K; 400 mV; Coulomb oscillations; RC delay; RC time constant; SOI single electron transistor; Si; Si fabrication process; amplification ratio; drain conductances; driving circuits; e-beam lithography; electron island; field effect transistor hybrid IC; high voltage gain amplification; in-plane side gate controlled complementary logic cells; input output voltage transfer; inverting property; microsiemens order; pattern dependent oxidation method; peak to valley current ratios; power amplification; silicon-on-insulator structure; single electron transistor hybrid integrated circuit; theoretical quantum limit; wide range output window; Delay; FETs; Fabrication; Hybrid integrated circuits; Integrated circuit yield; Logic circuits; Oxidation; Silicon on insulator technology; Single electron transistors; Voltage; Pattern-dependent oxidation (PADOX); SET-logic cells; peak-to-valley current ratio (PVCR); silicon-on-insulator; single-electron transistor; single-electron transistor (SET)/field-effect transistor (FET) hybrid integrated circuits (ICs); terahertz intrinsic speed;
  • fLanguage
    English
  • Journal_Title
    Nanotechnology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1536-125X
  • Type

    jour

  • DOI
    10.1109/TNANO.2004.837857
  • Filename
    1406001