• DocumentCode
    1247341
  • Title

    A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits

  • Author

    Wu, Tzong-Lin ; Wang, Chien-Chung ; Lin, Yen-Hui ; Wang, Ting-Kuang ; Chang, George

  • Author_Institution
    Dept. of Electr. of Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
  • Volume
    15
  • Issue
    3
  • fYear
    2005
  • fDate
    3/1/2005 12:00:00 AM
  • Firstpage
    174
  • Lastpage
    176
  • Abstract
    A novel L-bridged electromagnetic bandgap (EBG) power/ground planes is proposed with super-wideband suppression of the ground bounce noise (GBN) from 600Mz to 4.6GHz. The L-shaped bridge design on the EBG power plane not only broadens the stopband bandwidth, but also can increase the mutual coupling between the adjacent EBG cells by significantly decreasing the gap between the cells. It is found the small gap design can prevent from the severe degradation of the signal quality for the high-speed signal referring to the perforated EBG power plane. The excellent GBN suppression performance with keeping reasonably good signal integrity for the proposed structure is validated both experimentally and numerically. Good agreement is seen.
  • Keywords
    digital circuits; high-speed integrated circuits; integrated circuit design; integrated circuit noise; interference suppression; photonic band gap; 0.6 to 4.6 GHz; L-bridged electromagnetic bandgap; ground planes; high-speed digital circuits; power integrity; power plane; signal integrity; simultaneous switching noise; stopband bandwidth; super-wideband ground bounce noise elimination; Bandwidth; Circuit noise; Degradation; Digital circuits; Electromagnetic interference; Frequency; Metamaterials; Mutual coupling; Periodic structures; Photonic band gap; Electromagnetic bandgap (EBG); ground bounce noise (GBN); high-speed digital circuits; power integrity; signal integrity; simultaneously switching noises;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2005.844216
  • Filename
    1406067