• DocumentCode
    124773
  • Title

    Fast electromagnetic modeling of massively coupled vias in 3-D interconnects

  • Author

    Xichen Guo ; Jackson, David R. ; Ji Chen

  • Author_Institution
    Dept. of ECE, Univ. of Houston, Houston, TX, USA
  • fYear
    2014
  • fDate
    8-11 Jan. 2014
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Summary form only given. For 25 Gbps (clock frequency exceeding ~10 GHz) on-board signals, where the channel link becomes significantly noisy, active-circuit compensation techniques (e.g., pre-emphasis, adaptive equalization, etc.) are used to flatten the roll-off of the channel´s insertion loss, to increase the signal-to-noise ratio (SNR). Due to the fact that these active circuits usually need the response of the channel ahead of time, it is critical to build accurate models for the via interconnects.
  • Keywords
    compensation; electromagnetic interference; integrated circuit interconnections; integrated circuit modelling; three-dimensional integrated circuits; vias; 3D interconnects; EMI; SNR; active circuits; bit rate 25 Gbit/s; channel insertion loss; channel link; clock frequency; electromagnetic interference; fast electromagnetic modeling; massively coupled vias; noisy active-circuit compensation techniques; on-board signals; signal-to-noise ratio; Electromagnetic compatibility; Electromagnetic interference; Insertion loss; Integrated circuit interconnections; Ports (Computers); Signal to noise ratio; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio Science Meeting (USNC-URSI NRSM), 2014 United States National Committee of URSI National
  • Conference_Location
    Boulder, CO
  • Print_ISBN
    978-1-4799-3119-4
  • Type

    conf

  • DOI
    10.1109/USNC-URSI-NRSM.2014.6927990
  • Filename
    6927990