• DocumentCode
    1249631
  • Title

    Economic cost modeling of environmental-stress-screening and burn-in

  • Author

    Yan, Li ; English, John R.

  • Author_Institution
    Lucent Technol., Westminster, CO, USA
  • Volume
    46
  • Issue
    2
  • fYear
    1997
  • fDate
    6/1/1997 12:00:00 AM
  • Firstpage
    275
  • Lastpage
    282
  • Abstract
    The electronics industry is highly competitive. The introduction of new advanced integrated circuits continues. The manufacturer must develop a product with adequate life cycle, high quality and low failure rate in the specified time period. Environmental stress screening (ESS) is widely used in the electronics industry to assist in eliminating early or patent failures. The bathtub curve is a common model for the failure rate of a population. The classic bathtub curve has three parts: infant mortality; useful life; and wearout. However, some electronic products have latent defects which are not detected by conventional inspection or functional testing, and occur during the product useful life. Most electronic systems have finite useful life. As a result, technology obsolescence is of concern and should be considered, This paper uses a new interpretation and development of the bathtub curve that integrates: (1) latent failures; and (2) the concept of obsolescence, by constructing an integrated cost model used to determine both optimal burn-in and ESS times in the same environment
  • Keywords
    economics; environmental stress screening; failure analysis; integrated circuit manufacture; integrated circuit reliability; integrated circuit testing; bathtub curve; burn-in; economic cost modeling; electronics industry; environmental stress-screening; failure rate; integrated circuit reliability testing; latent defects; obsolescence; useful life; Assembly; Costs; Electronic equipment testing; Electronic switching systems; Electronics industry; Environmental economics; Inspection; Integrated circuit technology; Manufacturing; Stress;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/24.589957
  • Filename
    589957