Title :
A generalized algorithm for the capacitance extraction of 3D VLSI interconnects
Author :
Zhu, Zhenhai ; Hong, Wei
Author_Institution :
Ultima Interconnect Technol. Inc., Sunnyvale, CA, USA
fDate :
10/1/1999 12:00:00 AM
Abstract :
In this paper, a generalized algorithm based upon the nonoverlapping domain decomposition method (NDDM) is presented for the capacitance extraction of three-dimensional (3-D) VLSI interconnects. The subdomains with conductors are analyzed by the finite-difference method, while the subdomains with pure dielectric layers are analyzed with the eigenmode expansion technique. The central processing unit time and memory size used by the NDDM are unrelated to the thickness of pure dielectric layers. NDDM´s computing time grows as O(n) if the number of domain iterations is bounded. Also, benchmarks show that it is approximately 15 times less than those used by Ansoft´s Maxwell SpiceLink. In addition, only a two-dimensional mesh is needed to analyze 3-D structures. This greatly reduces the algorithm complexity and makes it easy and straightforward to interface with layout automation software
Keywords :
VLSI; capacitance; circuit layout CAD; eigenvalues and eigenfunctions; finite difference methods; integrated circuit interconnections; integrated circuit layout; iterative methods; 3D VLSI interconnects; algorithm complexity; capacitance extraction; domain iterations; eigenmode expansion technique; finite-difference method; layout automation software; nonoverlapping domain decomposition method; pure dielectric layers; two-dimensional mesh; Central Processing Unit; Conductors; Dielectric constant; Finite difference methods; Integrated circuit interconnections; Matrix decomposition; Millimeter wave technology; Parasitic capacitance; Software algorithms; Very large scale integration;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
