DocumentCode
125006
Title
Study on complicated nonlinear phenomena in ultrasonic infrared thermography using circuit simulation method
Author
Kai Zheng ; Jiang Zheng ; Shu-yi Zhang
Author_Institution
Jiangsu Province Special Equip. Safety Supervision Inspection Inst., Nanjing, China
fYear
2014
fDate
20-23 June 2014
Firstpage
19
Lastpage
29
Abstract
It has been shown that the complicated nonlinear vibration phenomena in mechanical workpieces under excitations of intense ultrasonic pulses increase greatly the detectability of defects (cracks). To study the nonlinear vibration phenomena of plates induced by the ultrasonic pulses, an electrical circuit model is proposed to simulate the mechanical vibro-impact motions between the transducer horn and plate sample based on the similar principles between electrical circuit systems and mechanical vibration systems. In the electronic circuit simulations of the nonlinear vibrations of plates, the analyses of the waveforms and frequency spectra are performed, which show that the harmonic, sub-harmonic, quasi-sub-harmonic and chaotic phenomena appear in the circuit model. The simulation calculation and data collection are simple and fast owing to algorithm of the Simulink. Therefore, the circuit simulation technique provides a useful approach to study and optimize ultrasonic infrared thermography for applying to NDE/T.
Keywords
crack detection; infrared imaging; plates (structures); ultrasonic materials testing; vibrations; chaotic phenomena; circuit simulation method; cracks; electrical circuit model; electrical circuit systems; frequency spectra; harmonic phenomena; mechanical vibro-impact motions; nonlinear vibration phenomena; plate sample; quasisub-harmonic phenomena; sub-harmonic phenomena; transducer horn; ultrasonic infrared thermography; ultrasonic pulses; Acoustics; Analytical models; Harmonic analysis; Integrated circuit modeling; Mathematical model; Oscillators; Vibrations; Non-linear vibration phenomenon; electrical circuit modeling; intense ultrasonic excitation;
fLanguage
English
Publisher
ieee
Conference_Titel
Nondestructive Evaluation/Testing (FENDT), 2014 IEEE Far East Forum on
Conference_Location
Chengdu
Print_ISBN
978-1-4799-4731-7
Type
conf
DOI
10.1109/FENDT.2014.6928226
Filename
6928226
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