• DocumentCode
    125006
  • Title

    Study on complicated nonlinear phenomena in ultrasonic infrared thermography using circuit simulation method

  • Author

    Kai Zheng ; Jiang Zheng ; Shu-yi Zhang

  • Author_Institution
    Jiangsu Province Special Equip. Safety Supervision Inspection Inst., Nanjing, China
  • fYear
    2014
  • fDate
    20-23 June 2014
  • Firstpage
    19
  • Lastpage
    29
  • Abstract
    It has been shown that the complicated nonlinear vibration phenomena in mechanical workpieces under excitations of intense ultrasonic pulses increase greatly the detectability of defects (cracks). To study the nonlinear vibration phenomena of plates induced by the ultrasonic pulses, an electrical circuit model is proposed to simulate the mechanical vibro-impact motions between the transducer horn and plate sample based on the similar principles between electrical circuit systems and mechanical vibration systems. In the electronic circuit simulations of the nonlinear vibrations of plates, the analyses of the waveforms and frequency spectra are performed, which show that the harmonic, sub-harmonic, quasi-sub-harmonic and chaotic phenomena appear in the circuit model. The simulation calculation and data collection are simple and fast owing to algorithm of the Simulink. Therefore, the circuit simulation technique provides a useful approach to study and optimize ultrasonic infrared thermography for applying to NDE/T.
  • Keywords
    crack detection; infrared imaging; plates (structures); ultrasonic materials testing; vibrations; chaotic phenomena; circuit simulation method; cracks; electrical circuit model; electrical circuit systems; frequency spectra; harmonic phenomena; mechanical vibro-impact motions; nonlinear vibration phenomena; plate sample; quasisub-harmonic phenomena; sub-harmonic phenomena; transducer horn; ultrasonic infrared thermography; ultrasonic pulses; Acoustics; Analytical models; Harmonic analysis; Integrated circuit modeling; Mathematical model; Oscillators; Vibrations; Non-linear vibration phenomenon; electrical circuit modeling; intense ultrasonic excitation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nondestructive Evaluation/Testing (FENDT), 2014 IEEE Far East Forum on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4799-4731-7
  • Type

    conf

  • DOI
    10.1109/FENDT.2014.6928226
  • Filename
    6928226