• DocumentCode
    125009
  • Title

    A guided wave approach for real-time health monitoring of high-speed train bogie frames

  • Author

    Ming Hong ; Qiang Wang ; Zhongqing Su

  • Author_Institution
    Dept. of Mech. Eng., Hong Kong Polytech. Univ., Hong Kong, China
  • fYear
    2014
  • fDate
    20-23 June 2014
  • Firstpage
    39
  • Lastpage
    43
  • Abstract
    An online health monitoring system (OHMS) was tailor-made and implemented for structural health monitoring (SHM) of train structures. A sensor network made up of miniature piezoelectric wafers was configured on the bogie frames of China´s latest high-speed train model. Ultrasonic guided waves were generated through the sensor network, and a variety of signal features were retrieved and fused by the system´s built-in program. During the train´s conformance testing on the Beijing-Shanghai High-Speed Railway, continuous SHM was carried out for departure, speed-up, full speed operation (300 km/h), emergency brake, track change, and stop. Artificial damage affixed to the bogie´s side panel was successfully located by the OHMS under both static and dynamic conditions, and the results were rapidly visualized through a probability-based diagnostic imaging algorithm. This in-situ test has demonstrated the practicality and effectiveness of guided-wave-based SHM for high-speed train bogies under working conditions.
  • Keywords
    condition monitoring; transportation; ultrasonic materials testing; Beijing-Shanghai High-Speed Railway; artificial damage; high-speed train bogie frames; miniature piezoelectric wafers; online health monitoring system; real-time health monitoring; structural health monitoring; train structures; ultrasonic guided waves; Educational institutions; Loading; Monitoring; Real-time systems; Sensors; Signal processing; Testing; damage detection; guided waves; high-speed trains; structural health monitoring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nondestructive Evaluation/Testing (FENDT), 2014 IEEE Far East Forum on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4799-4731-7
  • Type

    conf

  • DOI
    10.1109/FENDT.2014.6928229
  • Filename
    6928229