• DocumentCode
    125040
  • Title

    Simulation study on quantitative evaluation of crack depth in crack inspection with eddy current stimulated thermography

  • Author

    Xiang-xiang Yi ; Jin-jing Zeng ; Sui-xian Yang

  • Author_Institution
    Sch. of Manuf. Sci. & Eng., Sichuan Univ., Chengdu, China
  • fYear
    2014
  • fDate
    20-23 June 2014
  • Firstpage
    190
  • Lastpage
    194
  • Abstract
    Quantitative evaluation of cracks is the critical issue of eddy current stimulated thermography. In this paper, numerical simulation study on the quantitative evaluation of cracks with eddy current stimulated thermography is introduced. The simulation works are conducted using COMSOL software. Sequential images are obtained during the heating and cooling periods of the test process. By processing the images with Matlab toolbox, the features of temperature distribution on the samples with specific artificial crack were extracted. A form of the temperature history of the centre point of the cracks have been constructed with the simulation results which is applied to quantitate the crack parameters by Lagrange interpolation algorithm with the temperature at the surface centre point of the crack obtained from the infrared image. The simulation results show that the crack depth can be calculated with the form of crack temperature history.
  • Keywords
    cooling; crack detection; eddy current testing; heat treatment; infrared imaging; interpolation; temperature distribution; COMSOL software; Lagrange interpolation algorithm; Matlab toolbox; cooling; crack depth; crack inspection; crack parameters; crack temperature; eddy current stimulated thermography; heating; infrared image; numerical simulation; quantitative crack evaluation; sequential images; specific artificial crack; surface centre point; temperature distribution; Conductivity; Cooling; Eddy currents; Heating; Interpolation; Surface cracks; Transient analysis; crack depth; eddy current stimulated thermography; simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nondestructive Evaluation/Testing (FENDT), 2014 IEEE Far East Forum on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4799-4731-7
  • Type

    conf

  • DOI
    10.1109/FENDT.2014.6928260
  • Filename
    6928260