DocumentCode
125040
Title
Simulation study on quantitative evaluation of crack depth in crack inspection with eddy current stimulated thermography
Author
Xiang-xiang Yi ; Jin-jing Zeng ; Sui-xian Yang
Author_Institution
Sch. of Manuf. Sci. & Eng., Sichuan Univ., Chengdu, China
fYear
2014
fDate
20-23 June 2014
Firstpage
190
Lastpage
194
Abstract
Quantitative evaluation of cracks is the critical issue of eddy current stimulated thermography. In this paper, numerical simulation study on the quantitative evaluation of cracks with eddy current stimulated thermography is introduced. The simulation works are conducted using COMSOL software. Sequential images are obtained during the heating and cooling periods of the test process. By processing the images with Matlab toolbox, the features of temperature distribution on the samples with specific artificial crack were extracted. A form of the temperature history of the centre point of the cracks have been constructed with the simulation results which is applied to quantitate the crack parameters by Lagrange interpolation algorithm with the temperature at the surface centre point of the crack obtained from the infrared image. The simulation results show that the crack depth can be calculated with the form of crack temperature history.
Keywords
cooling; crack detection; eddy current testing; heat treatment; infrared imaging; interpolation; temperature distribution; COMSOL software; Lagrange interpolation algorithm; Matlab toolbox; cooling; crack depth; crack inspection; crack parameters; crack temperature; eddy current stimulated thermography; heating; infrared image; numerical simulation; quantitative crack evaluation; sequential images; specific artificial crack; surface centre point; temperature distribution; Conductivity; Cooling; Eddy currents; Heating; Interpolation; Surface cracks; Transient analysis; crack depth; eddy current stimulated thermography; simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Nondestructive Evaluation/Testing (FENDT), 2014 IEEE Far East Forum on
Conference_Location
Chengdu
Print_ISBN
978-1-4799-4731-7
Type
conf
DOI
10.1109/FENDT.2014.6928260
Filename
6928260
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