DocumentCode
125044
Title
Early contact fatigue evaluation of gear using eddy current pulsed thermography
Author
Jia Liu ; Wenwei Ren ; Gui Yun Tian ; Bin Gao ; Jin Song Meng ; Yizhe Wang
Author_Institution
Sch. of Autom. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear
2014
fDate
20-23 June 2014
Firstpage
208
Lastpage
212
Abstract
One of the most common gear damages is contact fatigue damage, which is difficult to be detected at an early stage. As one of the integrative non-destructive testing and evaluation techniques (NDTE) of eddy current and thermography, eddy current pulsed thermography (ECPT) has been applied for fatigue damage characterization. However, quantitative material state characterization before microcrack initiation do not be solved completely in previous work of ECPT. In this paper, the heat flow can be tracked by using optical flow method and the transient thermal behaviour among areas where the gear flank is suffered contact fatigue and not suffered contact fatigue is evaluated. The degree of fatigue is quantified across a thermal image sequence. The relationship among optical flow, the transient thermal behavior and microstructure of gear fatigue at an early stage is established. The results show that the fatigue damage of gear can be well evaluated by using this method.
Keywords
crystal microstructure; eddy current testing; fatigue; gears; heat transfer; image sequences; infrared imaging; wear; ECPT; NDTE; contact fatigue damage; contact fatigue evaluation; eddy current pulsed thermography; gear damages; gear fatigue; gear flank; heat flow; integrative nondestructive testing-and-evaluation; material state; microstructure; optical flow method; thermal image sequence; transient thermal behaviour; Computer vision; Eddy currents; Fatigue; Gears; Heating; Image motion analysis; Transient analysis; Eddy Current Pulsed Thermography; Fatigue damage; Gear failure; Non-destructive testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Nondestructive Evaluation/Testing (FENDT), 2014 IEEE Far East Forum on
Conference_Location
Chengdu
Print_ISBN
978-1-4799-4731-7
Type
conf
DOI
10.1109/FENDT.2014.6928264
Filename
6928264
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