DocumentCode :
1251428
Title :
Test structure to investigate the series resistance components of source/drain structure
Author :
Biesemans, S. ; Kubicek, S. ; De Meyer, K.
Author_Institution :
IMEC, Leuven, Belgium
Volume :
18
Issue :
10
fYear :
1997
Firstpage :
477
Lastpage :
479
Abstract :
The source and drain (S/D) structure is a key element in scaling down the MOSFET for low-power applications below 0.25-μm dimensions. Here, we report on a simple test structure and show how more detailed information on the parasitic series resistance components of deep submicron devices can be obtained. Specifically, the dependence of the different resistance components on the process parameters like dose and energy of implantation, temperature treatment, spacer width, and silicide formation can be investigated with high accuracy.
Keywords :
MOSFET; contact resistance; electric resistance measurement; ion implantation; semiconductor device metallisation; semiconductor device testing; 0.06 to 0.33 mum; CoSi/sub 2/-Si; MOSFET scaling; deep submicron devices; extension diffusion resistance; implantation dose; implantation energy; low-power applications; resistor length; series resistance components; silicide formation; silicide/Si contact resistance; source/drain structure; spacer width; temperature treatment; test structure; CMOS technology; Contact resistance; Electrical resistance measurement; MOSFET circuits; Resistors; Silicides; Space technology; Temperature dependence; Testing; Very large scale integration;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.624920
Filename :
624920
Link To Document :
بازگشت