DocumentCode :
1251463
Title :
Whisker Formation Concepts—The End Game
Author :
Galyon, George
Author_Institution :
Syst. & Technol. Div., IBM Corp., Armonk, NY, USA
Volume :
1
Issue :
7
fYear :
2011
fDate :
7/1/2011 12:00:00 AM
Firstpage :
1098
Lastpage :
1109
Abstract :
This paper elaborates on previously published theories dealing with tin whisker formation mechanisms and introduces some new concepts to build a theory that is both fundamentally sound and consistent with experimental observations made to date. Central to the proposed hypothesis is the unique chevron (or V-shaped) whisker grain that forms within the as-deposited tin film grain structure. This treatment also deals with some ancillary tin film observations such as the intermetallic “pedestal” structures formed by temperature cycling and the “subsidence” structures often associated with tin whisker formation.
Keywords :
grain boundaries; metallic thin films; tin; whiskers (crystal); Sn; as-deposited film grain structure; intermetallic pedestal structure; subsidence structure; temperature cycling; whisker formation concept; Copper; Grain boundaries; Strain; Stress; Substrates; Surface morphology; Tin; Back stresses; grain boundary slip; grain subsidence; grain-boundary order; inter-metallic pedestals; long-range diffusion; surface diffusion; tin whiskers; whisker grains; whisker kinking;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2010.2103319
Filename :
5910364
Link To Document :
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