Title :
Whisker Formation Concepts—The End Game
Author_Institution :
Syst. & Technol. Div., IBM Corp., Armonk, NY, USA
fDate :
7/1/2011 12:00:00 AM
Abstract :
This paper elaborates on previously published theories dealing with tin whisker formation mechanisms and introduces some new concepts to build a theory that is both fundamentally sound and consistent with experimental observations made to date. Central to the proposed hypothesis is the unique chevron (or V-shaped) whisker grain that forms within the as-deposited tin film grain structure. This treatment also deals with some ancillary tin film observations such as the intermetallic “pedestal” structures formed by temperature cycling and the “subsidence” structures often associated with tin whisker formation.
Keywords :
grain boundaries; metallic thin films; tin; whiskers (crystal); Sn; as-deposited film grain structure; intermetallic pedestal structure; subsidence structure; temperature cycling; whisker formation concept; Copper; Grain boundaries; Strain; Stress; Substrates; Surface morphology; Tin; Back stresses; grain boundary slip; grain subsidence; grain-boundary order; inter-metallic pedestals; long-range diffusion; surface diffusion; tin whiskers; whisker grains; whisker kinking;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2010.2103319