• DocumentCode
    1252090
  • Title

    Characterization and modeling of on-chip spiral inductors for Si RFICs

  • Author

    Chao, Chuan-Jane ; Wong, Shyh-Chyi ; Kao, Chi-Hung ; Chen, Ming-Jer ; Leu, Len-Yi ; Chiu, Kuang-Yi

  • Author_Institution
    Inst. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • Volume
    15
  • Issue
    1
  • fYear
    2002
  • fDate
    2/1/2002 12:00:00 AM
  • Firstpage
    19
  • Lastpage
    29
  • Abstract
    The paper presents a complete characterization of on-chip inductors fabricated in BiCMOS technology. First, a study of the scaling effect of inductance on geometry and structure parameters is presented to provide a clear guideline on inductor scaling with suitable quality factors. The substrate noise analysis and noise reduction techniques are then investigated. It is shown that floating well can improve both quality factor and noise elimination by itself under 3 GHz and together with a guard ring above 3 GHz. Finally, for accurate circuit simulations, a new inductor model is developed for predicting the skin effect and eddy effect and associated quality factor and inductance.
  • Keywords
    BiCMOS integrated circuits; MMIC; Q-factor; UHF integrated circuits; elemental semiconductors; equivalent circuits; inductors; integrated circuit modelling; integrated circuit noise; interference suppression; modelling; silicon; skin effect; 3 GHz; BiCMOS technology; Si; Si RFICs; characterization; circuit simulations; eddy effect prediction; equivalent lumped circuit; floating well; geometry; guard ring; inductance; inductor model; noise reduction techniques; onchip spiral inductors; quality factors; scaling effect; skin effect prediction; structure parameters; substrate noise analysis; BiCMOS integrated circuits; Circuit noise; Geometry; Inductance; Inductors; Noise reduction; Paper technology; Q factor; Radiofrequency integrated circuits; Spirals;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2002.983440
  • Filename
    983440