• DocumentCode
    1252258
  • Title

    RTD/HFET low standby power SRAM gain cell

  • Author

    van der Wagt, J.P.A. ; Seabaugh, A.C. ; Beam, E.A., III

  • Author_Institution
    Raytheon TI Syst., Dallas, TX, USA
  • Volume
    19
  • Issue
    1
  • fYear
    1998
  • Firstpage
    7
  • Lastpage
    9
  • Abstract
    A 50-nW standby power compound semiconductor tunneling-based static random access memory SRAM (TSRAM) cell is demonstrated by combining ultralow current-density resonant-tunneling diodes (RTDs) and heterostructure field-effect transistors (HFETs) in one integrated process on an InP substrate. This power represents over two orders of magnitude improvement over previous III-V static memory cells. By increasing the number of vertically integrated RTD´s we obtain a 100 nW tri-state memory cell. The cell concept applies to any material system in which low current-density negative differential resistance devices are available.
  • Keywords
    III-V semiconductors; JFET integrated circuits; SRAM chips; field effect memory circuits; indium compounds; resonant tunnelling diodes; 50 nW; III-V compound semiconductor; InP; InP substrate; RTD/HFET low standby power SRAM gain cell; TSRAM; heterostructure field-effect transistor; negative differential resistance device; tri-state memory cell; tunneling-based static random access memory; ultralow current-density resonant-tunneling diode; vertical integration; Current density; Cutoff frequency; HEMTs; Indium compounds; Indium phosphide; MODFETs; Random access memory; Resonant tunneling devices; SRAM chips; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.650335
  • Filename
    650335