• DocumentCode
    1253044
  • Title

    Placement for reliability and routability of convectively cooled PWBs

  • Author

    Osterman, Michael D. ; Pecht, Michael

  • Author_Institution
    CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
  • Volume
    9
  • Issue
    7
  • fYear
    1990
  • fDate
    7/1/1990 12:00:00 AM
  • Firstpage
    734
  • Lastpage
    744
  • Abstract
    A coupled reliability and routability placement procedure for arranging electronic components on a convectively cooled two-dimensional workspace, printed wiring boards (PWBs), is developed. The objective is to improve the total reliability of all the components on the PWB by minimizing the sum of the individual component failure rates (i.e. minimizing the total failure rate) while also minimizing the total wire length. The placement procedures for reliability are based on a priority metric derived from a temperature-dependent failure rate equation and heat transfer equations for a single row of convectively cooled components. After a brief discussion of the force-directed methodology in terms of placement for routability and its relation to placement for reliability, a theory of placement for reliability on convectively cooled PWBs is discussed, and placement procedures for reliability along a row and an entire PWB are presented. A force-directed placement technique for reliability is developed, and the coupled placement procedure for reliability and routability is introduced. Examples of each procedure are presented and discussed
  • Keywords
    circuit layout; circuit reliability; failure analysis; printed circuit design; component failure rates; convectively cooled PWBs; coupled placement procedure; electronic components; heat transfer equations; placement procedure; priority metric; reliability; routability; row; temperature-dependent failure rate equation; total wire length; Acceleration; Cooling; Electronic components; Equations; Heat transfer; Kelvin; Minimization; Reliability theory; Temperature; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.55206
  • Filename
    55206