DocumentCode
1253044
Title
Placement for reliability and routability of convectively cooled PWBs
Author
Osterman, Michael D. ; Pecht, Michael
Author_Institution
CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
Volume
9
Issue
7
fYear
1990
fDate
7/1/1990 12:00:00 AM
Firstpage
734
Lastpage
744
Abstract
A coupled reliability and routability placement procedure for arranging electronic components on a convectively cooled two-dimensional workspace, printed wiring boards (PWBs), is developed. The objective is to improve the total reliability of all the components on the PWB by minimizing the sum of the individual component failure rates (i.e. minimizing the total failure rate) while also minimizing the total wire length. The placement procedures for reliability are based on a priority metric derived from a temperature-dependent failure rate equation and heat transfer equations for a single row of convectively cooled components. After a brief discussion of the force-directed methodology in terms of placement for routability and its relation to placement for reliability, a theory of placement for reliability on convectively cooled PWBs is discussed, and placement procedures for reliability along a row and an entire PWB are presented. A force-directed placement technique for reliability is developed, and the coupled placement procedure for reliability and routability is introduced. Examples of each procedure are presented and discussed
Keywords
circuit layout; circuit reliability; failure analysis; printed circuit design; component failure rates; convectively cooled PWBs; coupled placement procedure; electronic components; heat transfer equations; placement procedure; priority metric; reliability; routability; row; temperature-dependent failure rate equation; total wire length; Acceleration; Cooling; Electronic components; Equations; Heat transfer; Kelvin; Minimization; Reliability theory; Temperature; Thermal resistance;
fLanguage
English
Journal_Title
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/43.55206
Filename
55206
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