ESD packaging requirements for an opto-electronic receiver module

Author

Foster, Eric M. ; Wolff, Richard J.

Author_Institution

IBM Corp., Endicott, NY, USA

Volume

13

Issue

4

fYear

1990

fDate

12/1/1990 12:00:00 AM

Firstpage

787

Lastpage

790

Abstract

The results are reported of several tests which were conducted on various packaging designs to determine the significant features affecting electrostatic discharge (ESD) susceptibility. The use of metallurgical versus metal-filled epoxy assembly of the package elements (housing, lid, substrate), and low resistance versus full closure between the packaging elements were investigated. The experimental results indicate that a complete metal enclosure must encase the sensitive circuitry within the module. A package based on this principle was designed, resulting in acceptable ESD performance

Keywords

electromagnetic compatibility; electrostatic discharge; integrated optoelectronics; optical communication equipment; packaging; receivers; ESD packaging requirements; complete metal enclosure; experimental results; features affecting ESD susceptibility; full closure; opto-electronic receiver module; packaging designs; Assembly; Bit error rate; Circuits; Electrostatic discharge; Lead; Optical receivers; Packaging; Substrates; Surface treatment; Testing;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.62519

Filename

62519