ESD packaging requirements for an opto-electronic receiver module

The results are reported of several tests which were conducted on various packaging designs to determine the significant features affecting electrostatic discharge (ESD) susceptibility. The use of metallurgical versus metal-filled epoxy assembly of the package elements (housing, lid, substrate), and low resistance versus full closure between the packaging elements were investigated. The experimental results indicate that a complete metal enclosure must encase the sensitive circuitry within the module. A package based on this principle was designed, resulting in acceptable ESD performance