Title :
Method for modelling substrate coupling in large chip designs
Author :
Singh, Rajdeep ; Sali, S.
Author_Institution :
Dept. of Electr. & Electron. Eng., Newcastle upon Tyne Univ.
fDate :
5/22/1997 12:00:00 AM
Abstract :
The authors present a novel method for modelling substrate noise in large mixed-signal SPICE designs. The approach is very efficient and can be applied to large designs with many digital blocks. An example circuit, which cannot be efficiently analysed with any current method, is used to demonstrate this new method
Keywords :
SPICE; integrated circuit design; integrated circuit modelling; integrated circuit noise; mixed analogue-digital integrated circuits; substrates; SPICE model; large chip design; mixed-signal circuit; substrate coupling; substrate noise;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19970639
