DocumentCode
1253705
Title
Foreword SEMITHERM XIII
Author
Seri Lee ; Manno, Vincent P. ; Simons, R.E.
Volume
20
Issue
4
fYear
1997
Firstpage
382
Lastpage
383
Keywords
Electronic packaging thermal management; Heat sinks; Heat transfer; Libraries; Microchannel; Multichip modules; Numerical models; Thermal management; Thermal management of electronics; Water heating;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/TCPMA.1997.650926
Filename
650926
Link To Document