The world of thermal characterization according to DELPHI-Part II: Experimental and numerical methods

Author

Lasance, Clemens J M ; Rosten, Harvey I. ; Parry, John D.

Author_Institution

Philips Res. Lab., Eindhoven, Netherlands

Volume

20

Issue

4

fYear

1997

fDate

12/1/1997 12:00:00 AM

Firstpage

392

Lastpage

398

Abstract

For pt.I see ibid., vol.20, no.4, pp.384-91 (1997). The purpose of the second part of the DELPHI survey paper is twofold. First, to describe the experimental methods that have been developed to validate the numerical models generated to characterize a certain electronic part in full detail and second, to highlight the various approaches that were studied to generate compact models from the detailed models. It can be concluded that the results of the experimental as well as the numerical methods which are highlighted in this part are characterized by a high accuracy, typically of the order of 95% or better

Keywords

heat conduction; packaging; DELPHI project; compact model; detailed model; electronic part; numerical model; thermal characterization; Associate members; Boundary conditions; Character generation; Cold plates; Electrical resistance measurement; Electronic packaging thermal management; Laboratories; Numerical models; Testing; Thermal resistance;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.650928

Filename

650928