Title :
The world of thermal characterization according to DELPHI-Part II: Experimental and numerical methods
Author :
Lasance, Clemens J M ; Rosten, Harvey I. ; Parry, John D.
Author_Institution :
Philips Res. Lab., Eindhoven, Netherlands
fDate :
12/1/1997 12:00:00 AM
Abstract :
For pt.I see ibid., vol.20, no.4, pp.384-91 (1997). The purpose of the second part of the DELPHI survey paper is twofold. First, to describe the experimental methods that have been developed to validate the numerical models generated to characterize a certain electronic part in full detail and second, to highlight the various approaches that were studied to generate compact models from the detailed models. It can be concluded that the results of the experimental as well as the numerical methods which are highlighted in this part are characterized by a high accuracy, typically of the order of 95% or better
Keywords :
heat conduction; packaging; DELPHI project; compact model; detailed model; electronic part; numerical model; thermal characterization; Associate members; Boundary conditions; Character generation; Cold plates; Electrical resistance measurement; Electronic packaging thermal management; Laboratories; Numerical models; Testing; Thermal resistance;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
