Title :
High power multichip modules employing the planar embedding technique and microchannel water heat sinks
Author :
Hahn, Robert ; Kamp, Andreas ; Ginolas, Arnim ; Schmidt, M. ; Wolf, Jürgen ; Glaw, Veronika ; Töpper, Michael ; Ehrmann, Oswin ; Reichl, Herbert
Author_Institution :
Fraunhofer Inst. IZM, Berlin, Germany
fDate :
12/1/1997 12:00:00 AM
Abstract :
This paper describes a novel packaging technology for high power multichip modules (MCMs). The work covers three areas: The fabrication of a multichip module which provides access to the die backside for heat removal, the development of high performance microchannel heat sinks with a matched CTE, as well as a low thermal resistivity assembling technology. The MCM is fabricated by means of the planar embedding technology. By planarizing the module backside a low thermal resistance between heat sink and dice can be accomplished simultaneously for all embedded components. A thermotest module of size 2×2 capable of a power dissipation of several hundred watts was fabricated. Thermal resistance values below 0.6 Kcm2/W at 50 W/cm2 chip flux have been achieved
Keywords :
cooling; heat sinks; integrated circuit packaging; multichip modules; thermal conductivity; thermal expansion; 2 in; assembling technology; die backside; heat removal; high power multichip modules; matched CTE; microchannel heat sinks; microchannel water heat sinks; packaging technology; planar embedding technique; power dissipation; thermal resistivity; thermotest module; Assembly; Conductivity; Fabrication; Heat sinks; Microchannel; Multichip modules; Packaging; Power dissipation; Resistance heating; Thermal resistance;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on