Pressure loss modeling for surface mounted cuboid-shaped packages in channel flow

Author

Teertstra, Pete ; Yovanovich, M. Michael ; Culham, J. Richard

Author_Institution

Microelectron. Heat Transfer Lab., Waterloo Univ., Ont., Canada

Volume

20

Issue

4

fYear

1997

fDate

12/1/1997 12:00:00 AM

Firstpage

463

Lastpage

469

Abstract

An analytical model is presented that predicts pressure loss for fully developed flow for air in a parallel plate channel with an array of uniformly-sized and spaced cuboid blocks on one wall. The model is intended for use in optimizing enclosure designs for air cooled electronics equipment containing arrays of printed circuit boards. Using a composite solution, based on the laminar and turbulent smooth wall channel limiting cases, the friction factor for periodic fully developed how can be calculated as a function of the array geometry and fluid velocity. The resulting model is applicable for a full range of Reynolds numbers, 1⩽Re_Dhˇ⩽100000 and accurately predicts the available measured values to within a 15% average difference

Keywords

channel flow; cooling; friction; packaging; surface mount technology; Reynolds number; air cooled electronics equipment; analytical model; enclosure design; friction factor; laminar flow; parallel plate channel flow; pressure loss; printed circuit board array; smooth wall; surface mounted cuboid-shaped package; turbulent flow; Analytical models; DH-HEMTs; Design optimization; Electronic equipment; Electronics packaging; Friction; Geometry; Packaging machines; Predictive models; Printed circuits;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.650936

Filename

650936