Title :
Terminology for use of parts outside manufacturer-specified temperature ranges
Author :
Condra, Lloyd ; Hoad, Richard ; Humphrey, David ; Brennom, Thomas ; Fink, John ; Heebink, Joel ; Wilkinson, Chris ; Marlborough, David ; Das, Diganta ; Pendsé, Neeraj ; Pecht, Michael G. ; Pecht, Michael G.
Author_Institution :
Boeing Aerosp., Seattle, WA, USA
fDate :
9/1/1999 12:00:00 AM
Abstract :
The use of the definitions described in this article related to the use of semiconductor parts outside manufacturer-specified temperature range represents a consensus among various sectors of the electronics industry. The use of these terms and definitions will improve the understanding of the issues involved, facilitate communication across the supply chain, and provide legal clarity
Keywords :
electronics industry; nomenclature; electronics industry; manufacturer-specified temperature range; semiconductor part; terminology; Electronics industry; Law; Legal factors; Manufacturing industries; Manufacturing processes; Regulators; Semiconductor device manufacture; Supply chains; Temperature distribution; Terminology;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/6144.796532
