DocumentCode
1253813
Title
Terminology for use of parts outside manufacturer-specified temperature ranges
Author
Condra, Lloyd ; Hoad, Richard ; Humphrey, David ; Brennom, Thomas ; Fink, John ; Heebink, Joel ; Wilkinson, Chris ; Marlborough, David ; Das, Diganta ; Pendsé, Neeraj ; Pecht, Michael G. ; Pecht, Michael G.
Author_Institution
Boeing Aerosp., Seattle, WA, USA
Volume
22
Issue
3
fYear
1999
fDate
9/1/1999 12:00:00 AM
Firstpage
355
Lastpage
356
Abstract
The use of the definitions described in this article related to the use of semiconductor parts outside manufacturer-specified temperature range represents a consensus among various sectors of the electronics industry. The use of these terms and definitions will improve the understanding of the issues involved, facilitate communication across the supply chain, and provide legal clarity
Keywords
electronics industry; nomenclature; electronics industry; manufacturer-specified temperature range; semiconductor part; terminology; Electronics industry; Law; Legal factors; Manufacturing industries; Manufacturing processes; Regulators; Semiconductor device manufacture; Supply chains; Temperature distribution; Terminology;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/6144.796532
Filename
796532
Link To Document