DocumentCode
1253816
Title
Is the maximum acceleration an adequate criterion of the dynamic strength of a structural element in an electronic product?
Author
Suhir, Ephraim
Author_Institution
Bell Labs., Lucent Technol. Inc., Murray Hill, NJ, USA
Volume
20
Issue
4
fYear
1997
fDate
12/1/1997 12:00:00 AM
Firstpage
513
Lastpage
517
Abstract
The dynamic strength of structural elements of micro- and portable electronic products is often evaluated on the basis of the measured maximum acceleration which these elements experience during shock or drop tests. It is well known, however, that it is the dynamic stress, not the acceleration, which is a true criterion of the dynamic strength. Using examples of structural elements that can be idealized as a simply supported beam or a cantilever beam with a concentrated mass at the end, we show that for elements of the given geometry and weight, the level of the maximum stress can be indeed judged upon on the basis of the measured acceleration. However, the application of the measured acceleration as a criterion of the dynamic strength can be misleading if applied to elements of different dimensions, weight and materials. We conclude that although the maximum acceleration is substantially easier to measure, it is the maximum dynamic stress that should be evaluated experimentally or theoretically when there is a need to establish the level of the dynamic strength of a structural element of an electronic product and the role of different factors affecting this strength. The obtained information can be helpful when evaluating the results of, or designing drop tests for electronic products
Keywords
acceleration; dynamic testing; mechanical strength; packaging; cantilever beam; drop test; dynamic strength; dynamic stress; maximum acceleration; microelectronic product; portable electronic product; shock test; simply supported beam; structural element; Acceleration; Accelerometers; Capacitive sensors; Electric shock; Electronic equipment testing; Life estimation; Particle beams; Performance analysis; Stress measurement; Structural beams;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.650942
Filename
650942
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