DocumentCode :
1253820
Title :
Contact physics of gold microcontacts for MEMS switches
Author :
Hyman, Daniel ; Mehregany, Mehran
Author_Institution :
Dept. of Electr. Eng. & Appl. Phys., Case Western Reserve Univ., Cleveland, OH, USA
Volume :
22
Issue :
3
fYear :
1999
fDate :
9/1/1999 12:00:00 AM
Firstpage :
357
Lastpage :
364
Abstract :
This work presents a study of gold metallic contacts regarding contact resistance, heat dissipation, and surface damage in the normal-force regime of tens to hundreds of μN, which is typical of the contact forces from microactuation. The purpose of this work is to present the micromechanical switch designer with practical information on gold contact phenomena in this force regime, as most work in micrometallic contacts has focused on contact forces greater than 1 mN. Results indicate actuation forces of several hundred μN are required for reliable fully metallic contacts, with resistance and current carrying ability primarily dependent on morphology, thermal management, and nm-depth material properties of the contact electrodes
Keywords :
contact resistance; electrical contacts; gold; micromechanical devices; switches; Au; MEMS; contact force; contact resistance; gold microcontact; heat dissipation; metallic contact; microactuation; micromechanical switch; surface damage; surface morphology; thermal management; Contact resistance; Gold; Microswitches; Physics; Resistance heating; Surface morphology; Surface resistance; Switches; Thermal management; Thermal resistance;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/6144.796533
Filename :
796533
Link To Document :
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