• DocumentCode
    1253820
  • Title

    Contact physics of gold microcontacts for MEMS switches

  • Author

    Hyman, Daniel ; Mehregany, Mehran

  • Author_Institution
    Dept. of Electr. Eng. & Appl. Phys., Case Western Reserve Univ., Cleveland, OH, USA
  • Volume
    22
  • Issue
    3
  • fYear
    1999
  • fDate
    9/1/1999 12:00:00 AM
  • Firstpage
    357
  • Lastpage
    364
  • Abstract
    This work presents a study of gold metallic contacts regarding contact resistance, heat dissipation, and surface damage in the normal-force regime of tens to hundreds of μN, which is typical of the contact forces from microactuation. The purpose of this work is to present the micromechanical switch designer with practical information on gold contact phenomena in this force regime, as most work in micrometallic contacts has focused on contact forces greater than 1 mN. Results indicate actuation forces of several hundred μN are required for reliable fully metallic contacts, with resistance and current carrying ability primarily dependent on morphology, thermal management, and nm-depth material properties of the contact electrodes
  • Keywords
    contact resistance; electrical contacts; gold; micromechanical devices; switches; Au; MEMS; contact force; contact resistance; gold microcontact; heat dissipation; metallic contact; microactuation; micromechanical switch; surface damage; surface morphology; thermal management; Contact resistance; Gold; Microswitches; Physics; Resistance heating; Surface morphology; Surface resistance; Switches; Thermal management; Thermal resistance;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/6144.796533
  • Filename
    796533