DocumentCode :
1253821
Title :
CFD applied to electronic systems: a review
Author :
Tucker, Paul G.
Author_Institution :
Dept. of Appl. Phys. & Electron. & Manuf. Eng., Dundee Univ., UK
Volume :
20
Issue :
4
fYear :
1997
fDate :
12/1/1997 12:00:00 AM
Firstpage :
518
Lastpage :
529
Abstract :
The application of commercial and noncommercial computational fluid dynamics (CFD) programs to systems relevant to electronics is reviewed. The following commercial programs are discussed: THEBES, FLOTHERM, FLUENT, FLOTRAN, FIDAP/ICEPAK, CFX 4 (formerly CFDS-FLOW3D), PHOENICS/HOTBOX, and STAR-CD. Notably, of the noncommercial programs, work utilizing a spectral element program originating from the Massachusetts Institute of Technology (MIT) is described. General thermofluid capabilities, user friendliness, and other peripheral aspects, such as the modeling of thermal stress/strain and dust transport are assessed. For all comparisons with measurements, agreement was found to be within 30%. No commercial CFD program appeared to be clearly superior for all applications, but FLOTHERM had the most use for realistic cooling design problems
Keywords :
cooling; dust; flow simulation; fluid dynamics; reviews; CFD; CFDS-FLOW3D; CFX 4; FIDAP/ICEPAK; FLOTHERM; FLOTRAN; FLUENT; PHOENICS/HOTBOX; STAR-CD; THEBES; computational fluid dynamics; cooling design; dust transport; electronic system; review; spectral element program; thermal strain; thermal stress; thermofluid; Capacitive sensors; Computational fluid dynamics; Consumer electronics; Electronics cooling; Heat transfer; Pollution measurement; Power generation economics; Temperature sensors; Thermal conductivity; Thermal stresses;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9886
Type :
jour
DOI :
10.1109/95.650943
Filename :
650943
Link To Document :
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