DocumentCode :
1253829
Title :
A study of lubricants on silver flakes for microelectronics conductive adhesives
Author :
Lu, Daoqiang ; Tong, Quinn K. ; Wong, C.P.
Author_Institution :
MSE & Packaging Res. Centre, Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
22
Issue :
3
fYear :
1999
fDate :
9/1/1999 12:00:00 AM
Firstpage :
365
Lastpage :
371
Abstract :
Conductive adhesives are composites of polymer matrixes and metal fillers (conductive elements). Silver (Ag) flakes are widely used as fillers for electrically conductive adhesives (ECAs). Generally, there is a thin layer of organic lubricant coated on the commercial Ag flake surface. This lubricant layer is needed for eliminating the Ag particle agglomeration while dispersing the Ag filler into the polymeric resin. Therefore the lubricant influences rheology, conductivity, and other properties of ECA´s. The nature of the lubricant on a Ag flake and the interaction between the lubricant and the Ag flake surface were studied by diffuse reflectance infrared spectroscopy (DRIR). Thermal decomposition of the lubricant was studied by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). In addition, the effects of some chemical compounds on lubricant removal and the enhancement of conductivity of the ECA were also investigated. It was found that 1) a chemical bonding was formed on the Ag flake surface between the lubricant and Ag; 2) the short chain acids replaced the long chain lubricants; 3) an ether and a poly(ethylene glycol) enhanced electrical conductivity by partially removing the Ag flake lubricants
Keywords :
adhesives; conducting materials; differential scanning calorimetry; filled polymers; infrared spectra; lubrication; pyrolysis; reflectivity; silver; thermal analysis; Ag; differential scanning calorimetry; diffuse reflectance infrared spectroscopy; electrical conductivity; electrically conductive adhesive; metal filler; microelectronics; organic lubricant; polymer matrix; rheology; silver flake; thermal decomposition; thermogravimetric analysis; Active matrix organic light emitting diodes; Conductive adhesives; Conductivity; Lubricants; Microelectronics; Polymers; Reflectivity; Resins; Rheology; Silver;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/6144.796536
Filename :
796536
Link To Document :
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