DocumentCode :
1253853
Title :
Foreword Special Issue On The Latest Advances In IC Manufacturing In Asia
Author :
Trappey, Amy J. C.
Volume :
20
Issue :
4
fYear :
1997
Firstpage :
229
Lastpage :
229
Keywords :
Asia; Assembly; Electronics industry; Engineering management; Globalization; Industrial engineering; Manufacturing; Production; Research and development;
fLanguage :
English
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
Publisher :
ieee
ISSN :
1083-4400
Type :
jour
DOI :
10.1109/TCPMC.1997.650949
Filename :
650949
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1253853
