DocumentCode

1253853

Title

Foreword Special Issue On The Latest Advances In IC Manufacturing In Asia

Author

Trappey, Amy J. C.

Volume

20

Issue

4

fYear

1997

Firstpage

229

Lastpage

229

Keywords

Asia; Assembly; Electronics industry; Engineering management; Globalization; Industrial engineering; Manufacturing; Production; Research and development;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on

Publisher

ieee

ISSN

1083-4400

Type

jour

DOI

10.1109/TCPMC.1997.650949

Filename

650949