DocumentCode
1253871
Title
Integrated circuit packaging industry in Taiwan
Author
Lo, Choung-Lin ; Tung, Li-Rong
Author_Institution
Mater. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan
Volume
20
Issue
4
fYear
1997
fDate
10/1/1997 12:00:00 AM
Firstpage
243
Lastpage
255
Abstract
The integrated circuit (IC) industry in Taiwan is comprised mainly of IC chip design and fabrication, IC packaging, and system product design and fabrication industries. Fueled by rapid investment and development efforts from government and private sectors, this industry has sustained a rapid growth in recent years becoming one of the most profitable industries among Asian Pacific countries. This paper details Taiwan´s IC packaging manufacturing capabilities and its technology trends. It describes the Taiwan IC package industry´s ability to maintain favorable competitive leverage in the global business environment. This paper concentrates on two key areas of manufacturing and technology trends to illustrate Taiwan´s electronic industry in general: chip-level packages and substrate and its assembly. The requirements for different applications in the future packages are discussed. The reason for the packaging paradigm shifts and associated precautions are also explained
Keywords
electronics industry; integrated circuit packaging; Asian Pacific country; Taiwan; assembly; chip-level package; electronic industry; global business environment; integrated circuit packaging; manufacturing; substrate; technology; Chip scale packaging; Electronics packaging; Fabrication; Government; Integrated circuit packaging; Investments; Manufacturing industries; Product design; Pulp manufacturing; Textile industry;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
Publisher
ieee
ISSN
1083-4400
Type
jour
DOI
10.1109/3476.650952
Filename
650952
Link To Document