Analysis of thermal warpage in a PCB with an array of PTH connectors

Author

Djurovic, Boris ; Puzzo, Carmine A. ; Spelt, Jan K.

Author_Institution

Atomic Energy of Canada Ltd., Toronto, Ont., Canada

Volume

22

Issue

3

fYear

1999

fDate

9/1/1999 12:00:00 AM

Firstpage

414

Lastpage

420

Abstract

Finite element analysis (FEA) was used to model the thermally-induced warpage of a printed-circuit-board (PCB) assembly having an array of pin-through-hole (PTH) connectors during a dual-wave soldering process. The estimates of board warpage were compared with experimental measurements, and it was concluded that the model is capable of representing assembly deformation during and after wave soldering. Subsequent parametric studies of the effects of different PCB and connector material properties have resulted in general guidelines for the selection of these properties

Keywords

assembling; electric connectors; finite element analysis; printed circuit manufacture; thermal expansion; wave soldering; PCB; PCB material properties; PTH connector array; assembly deformation; connector material properties; dual-wave soldering process; finite element analysis; parametric studies; pin-through-hole connectors; thermal warpage; Assembly; Connectors; Deformable models; Field emitter arrays; Finite element methods; Pins; Printed circuits; Soldering; Thermal stresses; Thermomechanical processes;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.796544

Filename

796544