• DocumentCode
    1253887
  • Title

    A dispatching scheme involving move control and weighted due date for wafer foundries

  • Author

    Lee, Ching-En ; Chen, Chaw-Wen

  • Author_Institution
    Inst. of Ind. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • Volume
    20
  • Issue
    4
  • fYear
    1997
  • fDate
    10/1/1997 12:00:00 AM
  • Firstpage
    268
  • Lastpage
    277
  • Abstract
    Increasing automation of wafer foundries in Taiwan has heightened the demand to automate dispatching decisions in recent years. To attain a better global performance, dispatching decisions should be made based on critical shop floor information. In this study, we present a dispatching scheme which combines move control and weighted due date concepts, genetic algorithm (GA) and simulation. The move control and weighted due date concept is applied to identify important dispatching decision factors respecting performance indices of due-date satisfaction and throughput. The GA is employed to derive proper weights for those decision factors. A simulation procedure capable of simultaneously considering product mix, reentrant process, and the influence of random events on the shop floor is developed to evaluate the system performance based on the derived weights of decision factors. A case study involving a simplified and revised data set from a Taiwanese wafer foundry is presented. Results show that the dispatching scheme proposed in this paper is effective and outperforms six conventional dispatching rules (FIFO, SPT, SRPT, EDD, SLACK, and CR) on performance measures of due date satisfaction, throughput, WIP level, critical machine utilization, and mean cycle time under both CONWIP and uniform release policies
  • Keywords
    digital simulation; dispatching; genetic algorithms; integrated circuit manufacture; production control; CONWIP; Taiwan; WIP level; critical machine utilization; critical shop floor information; dispatching scheme; due date satisfaction; genetic algorithm; mean cycle time; move control; product mix; random events; reentrant process; simulation procedure; throughput; uniform release policies; wafer foundries; weighted due date; Automatic control; Automation; Chromium; Discrete event simulation; Dispatching; Foundries; Genetic algorithms; System performance; Throughput; Weight control;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1083-4400
  • Type

    jour

  • DOI
    10.1109/3476.650956
  • Filename
    650956