Evaluating IC-package interface delamination by considering moisture-induced molding-compound swelling

Author

Tanaka, Naotaka ; Kitano, Makoto ; Kumazawa, Tetsuo ; Nishimura, Asao

Author_Institution

Mech. Eng. Res. Lab., Hitachi Ltd., Ibaraki, Japan

Volume

22

Issue

3

fYear

1999

fDate

9/1/1999 12:00:00 AM

Firstpage

426

Lastpage

432

Abstract

We have determined the influence of moisture soaking conditions on true adhesion strength measured by our previously developed method. The drop in true adhesion strength of a specimen that absorbed moisture at 50°C is about 50% less than that of a specimen at 85°C. This result suggests that the true adhesion strength depends on not only the moisture content but also the moisture absorption temperature. Therefore, we think that the general moisture condition (85°C/85%) causes more damage to plastic integrated circuit (IC) packages than that of moisture absorption at room temperature. We also evaluated interface delamination in a moisture-absorbed package by considering the swelling of the molding compound due to moisture absorption. The predicted interface delamination agrees well with the experimental data for moisture-soaked packages

Keywords

adhesion; delamination; integrated circuit packaging; moisture; moulding; plastic packaging; swelling; 50 to 85 C; adhesion strength; interface delamination; moisture absorption; molding compound swelling; plastic integrated circuit package; residual stress; Adhesives; Delamination; Electromagnetic wave absorption; Integrated circuit packaging; Moisture measurement; Plastic integrated circuit packaging; Residual stresses; Soldering; Testing; Thermal stresses;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.796546

Filename

796546