Title :
Investigation of electronic assembly design alternatives through production modeling of life cycle impacts, costs, and yield
Author :
Stuart, Julie Ann ; Turbini, Laura J. ; Ammons, Jane Chumley
Author_Institution :
Dept. of Ind. Welding & Syst. Eng., Ohio State Univ., Columbus, OH, USA
fDate :
10/1/1997 12:00:00 AM
Abstract :
Environmental legislation, technological advances and increasingly competitive global markets have led to a number of different product and process design choices for electronics assemblies. Decision tools to aid in the selection of a product and process design have been limited to qualitative methodologies. In addition, trade-offs between environmental impacts, yield, and reliability have not been analyzed. In this paper, electronic assembly product and process design alternatives are investigated using a quantitative methodology with life cycle considerations for environmental impacts. These impacts include energy usage, material consumption, waste generation, process yield, and product reliability
Keywords :
assembling; environmental factors; integrated circuit reliability; integrated circuit yield; legislation; costs; electronic assembly design alternatives; energy usage; environmental legislation; global markets; life cycle considerations; life cycle impacts; material consumption; process design; process yield; production modeling; qualitative methodologies; reliability; waste generation; Assembly; Consumer electronics; Costs; Electrostatic discharge; Legislation; Manufacturing processes; Process design; Production; Waste materials; Wiring;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
DOI :
10.1109/3476.650964
