Title :
Nickel matrix composite electrocoatings as electrical contacts
Author :
Dervos, Constantine T. ; Kollia, C. ; Psarrou, S. ; Vassiliou, P.
Author_Institution :
Dept. of Electr. & Comput. Eng., Nat. Tech. Univ. of Athens, Greece
fDate :
9/1/1999 12:00:00 AM
Abstract :
The work presented in this paper explores the possibility of using composite nickel matrix electrodeposits prepared under direct current (DC) and pulse current (PC) conditions as electrical contact materials. The codeposition of liquid containing microcapsules (μcaps) along with the metal matrix from electrolytic baths leads to the development of new type of materials with prespecified properties: the liquid-containing metal electrocoatings. The incorporation, in the nickel matrix, of polymeric wall μcaps containing oil ensures a self-lubrication and cooling action during fretting or transient operation. The electrical properties of composite nickel electrodeposits have been investigated. Different preparation conditions have been employed. Their contact resistance and interfacial temperature have been monitored for a great number of operation cycles during the simultaneous application of mechanical and electrical fatigue. SEM and XRD analysis were applied toward investigating the structural characteristics of the inter-electrode surfaces
Keywords :
X-ray diffraction; cooling; electrical contacts; electrodeposits; fatigue; lubrication; nickel; particle reinforced composites; scanning electron microscopy; wear; Ni; composite electrocoatings; cooling action; direct current conditions; electrical contacts; electrical fatigue; electrodeposits; fretting; inter-electrode surfaces; interfacial temperature; liquid-containing metal electrocoatings; mechanical fatigue; microcapsules; polymeric wall; preparation conditions; pulse current conditions; self-lubrication; structural characteristics; transient operation; Composite materials; Contact resistance; Cooling; Fatigue; Inorganic materials; Nickel; Petroleum; Polymers; Temperature measurement; Temperature sensors;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/6144.796551