• DocumentCode
    1254090
  • Title

    Computation of transients in lossy VLSI packaging interconnections

  • Author

    Liao, J.C. ; Palusinski, Olgierd A. ; Prince, J.L.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
  • Volume
    13
  • Issue
    4
  • fYear
    1990
  • fDate
    12/1/1990 12:00:00 AM
  • Firstpage
    833
  • Lastpage
    838
  • Abstract
    An efficient method for analyzing the dynamic behavior of lossy electrical interconnects (with frequency-dependent parameters) in very large scale integration (VLSI) systems is presented. The method allows for the inclusion of electrical interconnects which are terminated by networks of lumped passive (R,L,C) and active nonlinear devices such as diodes and bipolar and MOS transistors. The method consists of deriving the circuit model for a transmission line from impulse response data and incorporating this model into an existing computer program called UANTL which performs time-domain analysis for coupled transmission lines with nonlinear termination. Several numerical experiments with this method were performed. Comparisons are made between the results obtained using this method and previously published results
  • Keywords
    VLSI; circuit analysis computing; metallisation; packaging; transients; transmission line theory; MOS transistors; UANTL; VLSI; active nonlinear devices; bipolar transistors; circuit model; computer program; coupled transmission lines; diodes; dynamic behavior; frequency-dependent parameters; impulse response data; lossy VLSI packaging interconnections; lossy electrical interconnects; lumped passive devices termination; nonlinear termination; nonlinearly terminated transmission line networks; numerical experiments; time-domain analysis; transient analysis; transients computation; transmission line; very large scale integration; Circuit analysis computing; Diodes; Distributed parameter circuits; Frequency; Integrated circuit interconnections; MOSFETs; Packaging; Power system transients; Time domain analysis; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.62527
  • Filename
    62527