DocumentCode :
1254090
Title :
Computation of transients in lossy VLSI packaging interconnections
Author :
Liao, J.C. ; Palusinski, Olgierd A. ; Prince, J.L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Volume :
13
Issue :
4
fYear :
1990
fDate :
12/1/1990 12:00:00 AM
Firstpage :
833
Lastpage :
838
Abstract :
An efficient method for analyzing the dynamic behavior of lossy electrical interconnects (with frequency-dependent parameters) in very large scale integration (VLSI) systems is presented. The method allows for the inclusion of electrical interconnects which are terminated by networks of lumped passive (R,L,C) and active nonlinear devices such as diodes and bipolar and MOS transistors. The method consists of deriving the circuit model for a transmission line from impulse response data and incorporating this model into an existing computer program called UANTL which performs time-domain analysis for coupled transmission lines with nonlinear termination. Several numerical experiments with this method were performed. Comparisons are made between the results obtained using this method and previously published results
Keywords :
VLSI; circuit analysis computing; metallisation; packaging; transients; transmission line theory; MOS transistors; UANTL; VLSI; active nonlinear devices; bipolar transistors; circuit model; computer program; coupled transmission lines; diodes; dynamic behavior; frequency-dependent parameters; impulse response data; lossy VLSI packaging interconnections; lossy electrical interconnects; lumped passive devices termination; nonlinear termination; nonlinearly terminated transmission line networks; numerical experiments; time-domain analysis; transient analysis; transients computation; transmission line; very large scale integration; Circuit analysis computing; Diodes; Distributed parameter circuits; Frequency; Integrated circuit interconnections; MOSFETs; Packaging; Power system transients; Time domain analysis; Very large scale integration;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/33.62527
Filename :
62527
Link To Document :
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