DocumentCode
1254099
Title
Analysis and simulation of multiconductor transmission lines for high-speed interconnect and package design
Author
You, Hong ; Soma, Mani
Author_Institution
Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
Volume
13
Issue
4
fYear
1990
fDate
12/1/1990 12:00:00 AM
Firstpage
839
Lastpage
846
Abstract
An approach to the crosstalk and transient analysis of high-speed interconnects which are modeled as multiconductor transmission lines is presented. Closed-form formulas are derived for determining the voltage and current transfer functions based on the spectral-domain modal analysis technique. The transfer function is then expanded to its Taylor series form and the inverse Fourier transform is applied to the significant terms in the series. Analytical expressions of time-domain signal waveforms are consequently obtained. In addition to providing valuable insight into the coupling mechanism, results of the study facilitate the efficient computation of crosstalk, propagation delay, signal reflection, and waveform distortion
Keywords
circuit analysis computing; crosstalk; digital simulation; hybrid integrated circuits; packaging; transient response; transmission line theory; Taylor series form; coupling mechanism; crosstalk; current transfer functions; high-speed interconnect; inverse Fourier transform; multiconductor transmission lines; package design; propagation delay; signal reflection; spectral-domain modal analysis technique; time-domain signal waveforms; transient analysis; waveform distortion; Analytical models; Crosstalk; Fourier transforms; Modal analysis; Multiconductor transmission lines; Signal analysis; Taylor series; Transfer functions; Transient analysis; Voltage;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.62528
Filename
62528
Link To Document