Title :
Analysis and simulation of multiconductor transmission lines for high-speed interconnect and package design
Author :
You, Hong ; Soma, Mani
Author_Institution :
Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
fDate :
12/1/1990 12:00:00 AM
Abstract :
An approach to the crosstalk and transient analysis of high-speed interconnects which are modeled as multiconductor transmission lines is presented. Closed-form formulas are derived for determining the voltage and current transfer functions based on the spectral-domain modal analysis technique. The transfer function is then expanded to its Taylor series form and the inverse Fourier transform is applied to the significant terms in the series. Analytical expressions of time-domain signal waveforms are consequently obtained. In addition to providing valuable insight into the coupling mechanism, results of the study facilitate the efficient computation of crosstalk, propagation delay, signal reflection, and waveform distortion
Keywords :
circuit analysis computing; crosstalk; digital simulation; hybrid integrated circuits; packaging; transient response; transmission line theory; Taylor series form; coupling mechanism; crosstalk; current transfer functions; high-speed interconnect; inverse Fourier transform; multiconductor transmission lines; package design; propagation delay; signal reflection; spectral-domain modal analysis technique; time-domain signal waveforms; transient analysis; waveform distortion; Analytical models; Crosstalk; Fourier transforms; Modal analysis; Multiconductor transmission lines; Signal analysis; Taylor series; Transfer functions; Transient analysis; Voltage;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on