DocumentCode :
1254158
Title :
Process control system for VLSI fabrication
Author :
Sachs, Emanuel ; Guo, Ruey-Shan ; Ha, Sungdo ; Hu, Albert
Author_Institution :
Microsyt. Technol. Lab., MIT, Cambridge, MA, USA
Volume :
4
Issue :
2
fYear :
1991
fDate :
5/1/1991 12:00:00 AM
Firstpage :
134
Lastpage :
144
Abstract :
A modular framework for the implementation of process control in VLSI fabrication is described. The system integrates existing approaches to process control with new methodologies in order to achieve online optimization and control of unit processes with consideration of preceding and following process steps. The process control system is based on three core modules. The flexible recipe generator determines an initial operating point in response to a new product design. The run-by-run controller tunes the recipe between runs based on feedback from postprocess and in situ measurements. The real-time controller further modifies the equipment settings during a process step based on in situ measurements. The algorithmic bases of these modules are described. The flexible recipe generator was used to optimize the LPCVD (low-pressure chemical vapor deposition) of polysilicon. The run-by-run controller was used to locally optimize and control a simulation of the LPCVD of polysilicon
Keywords :
VLSI; chemical vapour deposition; integrated circuit manufacture; process computer control; LPCVD; VLSI fabrication; algorithmic bases; core modules; flexible recipe generator; in situ; initial operating point; low-pressure chemical vapor deposition; modular framework; online optimization; polycrystalline Si deposition; polysilicon; process control system; real-time controller; run-by-run controller; Chemical vapor deposition; Control systems; Design optimization; Fabrication; Feedback; Manufacturing; Optimization methods; Process control; Product design; Productivity; Space exploration; Very large scale integration;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/66.79725
Filename :
79725
Link To Document :
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