Title :
The power of connections
Author :
Keyes, Robert W.
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fDate :
5/1/1991 12:00:00 AM
Abstract :
The wiring ability of multilayer interconnects is examined. It is shown why the principal force driving interconnection technology has been the computer. Measuring the flexibility of a given technology by the number of ways it allows a designer to interconnect devices to realize a particular logical function is discussed. It is shown that the ability to construct very large systems with high-density wiring stems directly from digital representation and the preservation of a given digital representation through long series of operations. The future of interconnection technology is explored.<>
Keywords :
circuit layout; packaging; wiring; digital representation; high-density wiring; interconnection technology; logical function; multilayer interconnects; wiring ability; Boolean functions; Costs; Integrated circuit interconnections; Laboratories; Logic circuits; Logic devices; Modems; Substrates; Wires; Wiring;
Journal_Title :
Circuits and Devices Magazine, IEEE
