Title :
A method to predict an average activation energy for subassemblies
Author :
Seager, J.D. ; Fieselman, C.D.
Author_Institution :
IBM, Charlotte, NC, USA
fDate :
12/1/1988 12:00:00 AM
Abstract :
The problem of predicting an average acceleration effect under the Arrhenius model of a subassembly with known operating and stress conditions is addressed. The average effect includes the several failure mechanisms that can exist along with the several stress conditions across the product associated with unique temperature profiles. The averaging effect is modeled by predicting an average activation energy. An example is included to demonstrate the ease of the computation
Keywords :
electronic equipment testing; failure analysis; life testing; reliability; Arrhenius model; average acceleration effect; average activation energy; failure mechanisms; reliability; stress conditions; subassembly; Acceleration; Capacitors; Electronic components; Electronic equipment testing; Failure analysis; Kelvin; Life estimation; Predictive models; Stress; Temperature;
Journal_Title :
Reliability, IEEE Transactions on
